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Speak with an expert on our team for product recommendations tailored to your application OR to discuss engineering a customer-inspired solution.
OUR PRODUCTS
DESIGN YOUR DBR
IN 4 steps:
01. WAVELENGTH
Choose your wavelength in the drop down. Not seeing your specific wavelength? Contact Us for custom wavelength information.
Configure your DBR laser diode one step at a time. Each configuration you select will update our product recommendations shown below.
02. Chip Architecture
High Power Chip: Built for Performance. Maximizes output power while maintaining spectral stability.
Low Power Chip: Energy-Efficient and Compact. Ideal for low threshold currents.
High Operating Temperature Chip: Ideal for Harsh Environments. Optimized for high-temperature operations.
10 mW — 180 mW
04. PACKAGING
Chip on Submount (CoS): Basic platform for custom packaging. Small, metallized submount.
9MM: Simple, hermetically sealed. Optional photodiode.
C-Mount: Copper Tungsten (CuW) heatsink. For macro-packaging in ambient conditions.
TO-8: All-in-one with TEC, photodiode, and thermistor. Optional sealing.
TOSA: Compact with TEC and thermistor. Hermetically sealed.
Butterfly: For fiber-coupling. Lower output power due to efficiency losses.
Butterfly + Isolator: Fiber-coupled with isolation. Best for precision spectroscopy.
03. MOUNTING
Mode Hop Free (MHF): Ensures consistent power and wavelength tuning. Ideal for tunability
Virtual Point Source (VPS) Lens: Enables easy coupling into optics and detectors
MHF + VPS: Combines tunability and easy coupling for dynamic performance
SELECT A PRODUCT TO LEARN MORE
Results:
Wavelength:
Chip:
Power:
40 mW
– 180 mW
Packaging:
Mounting:
$2,900.00
Wavelength:
Chip:
Power:
20 mW
– 90 mW
Packaging:
Mounting:
$5,250.00
Wavelength:
Chip:
Power:
15 mW
– 80 mW
Packaging:
Mounting:
$5,750.00
Wavelength:
Chip:
Power:
40 mW
– 180 mW
Packaging:
Mounting:
$2,850.00
Wavelength:
Chip:
Power:
40 mW
– 180 mW
Packaging:
Mounting:
$2,750.00
Wavelength:
Chip:
Power:
40 mW
– 180 mW
Packaging:
Mounting: